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Laminating Equipment Product List and Ranking from 7 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

Laminating Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. 三共 Osaka//Trading company/Wholesale
  2. アユミ工業 Hyogo//Electronic Components and Semiconductors
  3. ハイテック・プレシジョン Gunma//Industrial Machinery
  4. 4 プレマテック Nagano//Industrial Machinery
  5. 4 ソーリンク Miyagi//Industrial Machinery
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Laminating Equipment Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. Adhesive Machine "Hartec" 三共
  2. [Comprehensive Catalog] Bonding Device VJ Series アユミ工業
  3. Bonding device ハイテック・プレシジョン
  4. Bonding Device "KAR02-2 TYPE" プレマテック
  5. 4 Bonding device ソーリンク

Laminating Equipment Product List

1～8 item / All 8 items

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[Comprehensive Catalog] Bonding Device VJ Series

[Comprehensive Catalog] Bonding Device VJ Series

It is possible to bond substrates and resin substrates coated with adhesive in a voidless manner for lamination in a vacuum.

The bonding device is a machine that joins wafers together using adhesives such as UV resin. It consists of a weighting and bonding chamber, an alignment mechanism, a bonding area inspection mechanism, and an angle deviation inspection mechanism. Additionally, it can be connected to a glove box for pre-treating substrates in an inert atmosphere. Depending on customer needs, it is possible to select the necessary functions from these mechanisms to configure the device. For more details, please download the catalog or contact us.

  • Vacuum Equipment
  • Wafer processing/polishing equipment

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Bonding device

Bonding device

Equipped with auto-alignment feature!

This product is a device designed for the precise positioning and bonding of two flat panels, such as LCD panels and touch panels.

  • Other processing machines

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Bonding device

Bonding device

A bonding device equipped with position correction and peeling functions through image inspection.

We will listen to your needs and design and manufacture custom solutions. We will assist you in solving the current requirements in your factory, such as labor-saving, cycle time improvement, automatic inspection, inventory management, modifications to equipment and electrical systems (design and equipment work), data collection, verification, and experimentation. We provide the latest and most optimal information and technology. Please contact us for more details.

  • Other process controls
  • Other measurement, recording and measuring instruments
  • Other conveying machines

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Line contact bonding method (atmospheric/vacuum) vacuum lamination device

Line contact bonding method (atmospheric/vacuum) vacuum lamination device

It demonstrates its power in high-difficulty bonding that deteriorates under atmospheric conditions!

Since bonding can be done under vacuum (10 Pa), high-quality products can be produced without being affected by bonding conditions.

  • Vacuum Equipment

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Organic EL sealing line (automatic transport type)

Organic EL sealing line (automatic transport type)

We will create equipment tailored to your requests, such as incorporating it into a glove box.

○ Vacuum bonding sealing device ○ Dispenser ○ UV irradiation unit ○ Hot plate ○ Cooling plate ○ N2 environment in the chamber ○ Substrate transfer robot

  • Vacuum Equipment
  • Organic EL

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Alignment technology

Alignment technology

A technology that utilizes sensors and image processing to perform precise positioning. Accurately corrects the work position.

We would like to introduce the "Alignment Technology" of Adtech Engineering Co., Ltd. Based on the alignment marks detected by sensors and image processing systems, we perform positioning and alignment, accurately correcting the workpiece position. Our high-precision alignment technology, developed through exposure equipment, enables high-precision positioning and alignment. [Examples of Equipment] ■ Bonding Equipment ■ Positioning Equipment *For more details, please refer to the PDF materials or feel free to contact us.

  • others

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Bonding Device "KAR02-2 TYPE"

Bonding Device "KAR02-2 TYPE"

You can perform the entire series of operations from applying adhesive, bonding, to UV spot curing with a single piece of equipment!

The "KAR02-2 TYPE" is a device used for bonding two substrates together using adhesives and similar materials. It is capable of performing a series of operations, including adhesive application, bonding, and UV spot curing, all with a single piece of equipment. It is suitable for bonding using optical elastic resins and adhesives, and by changing the lower stage, it can also bond LCMs. 【Features】 ■ Well-suited for bonding using optical elastic resins and adhesives ■ LCM bonding is possible by changing the lower stage ■ A device for bonding two substrates using adhesives and similar materials ■ Custom production is also available *For more details, please refer to the PDF document or feel free to contact us.

  • dispenser
  • Bonding Equipment

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Adhesive Machine "Hartec"

Adhesive Machine "Hartec"

Achieving an alignment error of 20 microns! Demonstrating great power in various bonding applications.

"Haltech" adopts the Non-Stress Flat Lamination (NSFL) method, allowing for the lamination of thin films that could not achieve high precision with conventional methods, without applying stress and in a natural state. No bubbles, waves, or curling phenomena occur. The overlap precision between two films is automatically read and controlled to achieve an accuracy of 20 microns. It is suitable for a wide range of applications, from lamination between films to lamination of laminated boards. We also have a track record of proposing, designing, and manufacturing inline automatic machines. [Features] - Lamination in a natural state without applying stress - No bubbles, waves, or curling phenomena occur - Overlap precision between two films is automatically read and controlled for alignment errors - Suitable for a wide range of applications, from lamination between films to lamination of laminated boards *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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